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GUANG ZHOU AUTOFOR PRECISION INTELLIGENT MANUFACTURING CO. LTD.
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High Centrifugal Force Type Precision Grinding Wheel For Removal Of Granular Sludge

GUANG ZHOU AUTOFOR PRECISION INTELLIGENT MANUFACTURING CO. LTD.
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High Centrifugal Force Type Precision Grinding Wheel For Removal Of Granular Sludge

Brand Name : AUTOFOR

Model Number : AUTOFOR-1600

Certification : CE/SGS

Place of Origin : China

MOQ : 1 pcs

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability : 1000 pcs/month

Delivery Time : 25days

Packaging Details : customized/wooden

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AUTOFOR centrifuge High centrifugal force type for high precision removal of granular sludge


Made in China World Quality


High centrifugal force type for high precision removal of granular sludge

Reuse of multiple cutting wire saw cutting fluid for cutting silicon wafers

Centrifugal force: 2200G, filtration accuracy 1-5 microns

Compared with other domestic brands: 30% increase

The industry's highest level of high-speed rotary separation and filtration of fine particles in coolant.


Features:


1. High-efficiency separation and filtration

Maximum speed (4000rpm), maximum centrifugal force (2200G) Powerful separation and filtration capabilities, to achieve efficient separation and filtration.

2. Powerful separation and filtration

The sludge is strongly dehydrated and can be recovered with a low moisture content.


size:


itemAUTOFOR-500AUTOFOR-1600
powerthree phaze 200V 50/60HZ
Appropriate delivery volume20~40L/min70~140L/min
Max. RPM4000rmp2800rmp
Centrifugal force2200G
capacitanceMAIN POWER5.5kw7.5kw
Gear motor0.2kw
sewage pump0.40kW0.75kW
Required air pressure0.5MPa

performance

※ Performance test conditions

[Test sample] Glass grinding slag (specific gravity 2.5)

Average particle diameter 2.3μm [test solution] water


sampleSS concentratiRemoval rate
Sewage8461mg/L
Filtered cleaning liquid (new model)2105mg/L75%

Particle size distribution chart


use:


Silicon processing

Various processes such as solar cells, semiconductor wafer materials, multilayer wire saw processing, band saw processing, etc.

Sapphire and glass processing

Various processing such as LED substrates, various processing such as hard disk glass substrates, polishing processing, internal and external processing, etc.

Various machine tools

Gun-hole drilling machines, boring machines, electrical discharge machines, precision grinders, electrolytic grinders, gear grinders, washing machines, cutting machines, centerless machines, double-head machines and other equipment for grinding, purification of grinding processing fluid, and chip recycling


[Introduction example] Wafer processing


The presence or absence of the centrifuge causes the SS concentration in the auxiliary tank to change


离心机的有无引起附属槽的SS浓度变化



※ Results of performance tests performed by our company


Introduction effect


Low-level stabilization of SS concentration; reusable working fluid to reduce operating costs; no need to change working fluids to reduce labor costs; stable processing



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